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1/4
STRUCTURE PRODUCT SERIES TYPE FUNCTION
Silicon monolithic integrated circuits Bipolar stepping motor driver
BD63940EFV
PWM constant current controllable two H bridge driver Forward, Reverse, Brake mode Parallel IN control
Absolute maximum ratings(Ta=25) Item Supply voltage
Limit Unit -0.2+36.0 V 1 1.1 W Power dissipation Pd 4.02 W Input voltage for control pin VIN -0.2+5.5 V RNF maximum voltage VRNF 0.5 V Maximum output current IOUT 1.23 A/phase Operating temperature range Topr -25+85 Storage temperature range Tstg -55+150 Junction temperature Tjmax +150 1 70mmx70mmx1.6mm glass epoxy board. Derating in done at 8.8mW/ for operating above Ta=25. 2 4-layer recommended board. Derating in done at 32.0mW/ for operating above Ta=25. 3 Do not, however exceed Pd, ASO and Tjmax=150.
Symbol VCC1,2
Recommended operating conditions (Ta=-25+85) Item Symbol Min. Supply voltage VCC1,2 19 Output current IOUT 4 Do not, however exceed Pd, ASO. This product isn't designed for protection against radioactive rays.
Typ. 24 0.7
Max. 28 0.94
Unit V A/phase
Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
REV. A
2/4 Electrical characteristics (Unless otherwise specified Ta=25, VCC1,2=24V) Limit Item Symbol Min. Typ. Max. Whole Circuit current at standby ICCST 0.6 2.0 Circuit current ICC 2.7 7.0 Control input (IN1A, IN1B, IN2A, IN2B, PS) H level input voltage VINH 2.0 L level input voltage VINL 0.8 Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance Output leak current Current control RNFX input current VREFX input current VREFX input voltage range Comparator offset Minimum on time RON ILEAK IRNF IVREF VREF VCOF tONMIN -40 -2.0 0 -20 0.3 1.4 -20 -0.1 0 0.7 1.8 10 0.4 20 1.2
Unit
Conditions
mA mA V V
PS=L PS=H, VREFX=0.4V
A A A V mV s
IOUT=0.7A, Sum of upper and lower
RNFX=0V VREFX=0V VREFX=0.4V R=39k,C=1000pF
REV. A
3/4 Package outline
Product No.
BD63940
Lot No.
HTSSOP-B24 (Unit: mm) Block diagram Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Pin name PGND IN2B VREF2 CR2 NC TEST GND PS CR1 VREF1 IN1B NC Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin name IN1A PGND VCC1 OUT1A RNF1 OUT1B OUT2B RNF2 OUT2A VCC2 NC IN2A
IN1A 13 IN1B 11 CR1 9
15 VCC1
LOGIC ONE SHOT Current Limit Comp.
16 OUT1A
Predriver
18 OUT1B 17 RNF1
VREF1 10
OCP
IN2A 24 IN2B 2 CR2 4
22 VCC2
LOGIC ONE SHOT
21 OUT2A
Predriver
19 OUT2B 20 RNF2
VREF2 3
OCP Current Limit Comp. Regulator TSD OVLO UVLO RESET
6 TEST
PGND 1 PGND 14 GND 7
NC : Non Connection
8 PS
REV. A
4/4 Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) Mounting errors and Inter-pin short When attaching to a printed circuit board, pay attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (11) TEST pin Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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